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As Vehicle Electronics Increase, Liquid Sealants Impact Reliability

    May 22, 2019

Electronics are critical vehicle systems. As the complexity of these systems continues to grow with the use of numerous advanced driver assistance systems (ADAS) on each vehicle, it is anticipated that in-vehicle electronics will continue to grow by 15% over the next 10 years, representing up to 50% of a vehicle’s total value! The majority of today’s in-vehicle electronics are technology-driven, which places an added emphasis on a high degree of reliability for these interdependent systems.

Additionally electric vehicle development continues to grow, with 130 new electrified vehicles predicted to hit the market by 2025 as forecasted by Automotive World. The impact of electrified propulsion will contribute to the need for material solutions to address performance of key component systems, including battery modules and electric drive systems.

As electronic complexity increases for both traditional vehicles and electric vehicles, so does the need for continuous reliability. To enhance reliability and optimize performance of vehicle electronics, the following must be addressed:

  • Prevent unwanted outside elements from intrusion (dust, dirt, road debris, fuel, oil, solvents)
  • Encapsulate and sealing critical connector interfaces
  • Dissipate heat
  • Protect against vibration or shock

Henkel offers several sealant solutions to address these needs, including:

  • Liquid gasketing prevents contamination and unitizes an electronic module with quick-cure sealants or LED sealants that cure within 30 seconds. This enables a smaller footprint on the shop floor to dispense and cure sealants. Liquid gasketing is very effective for wire harnesses and all vehicle electronic systems that interact with it.
  • Foam gasketing is the best option for electronic systems that require a sealant that is soft and able to conform to avoid distortion of thin walls. It offers high temperature performance up to 150 degrees Celsius, adheres to most aluminum and plastics and offers quick LED or UV curing.
  • Vacuum impregnation draws resin into voids to permanently seal microscopic gaps and leak paths, which enhances function protect against intrusion from moisture, solvents and other corrosive agents.
  • Potting encapsulates and seals critical connector interfaces to unitize components. It provides insulation and protects electronic components from moisture, dust and chemical corrosion, and eliminates mechanical fastening. In addition, potting provides heat transfer for heat-producing components.
  • Low pressure molding provides complete water-tight encapsulation and eliminates traditional housings. In addition, it offers chemical and temperature resistance with various thermal durability.
  • Thermal interface materials effectively absorb and dissipate heat and can also be used for gap filling to enable high performance functionality.

Henkel works with its OEM partners to assist them in identifying the right solution to solve their connectivity and reliability issues for vehicle electronics. In addition, Henkel continues to invest in developing new technologies to solve future issues with vehicle electric systems as complexity continues to increase.

To learn more about the essential role these solutions contribute to vehicle electronics, click here to download the presentation.

About the Author, Jeff Koehler

Jeff Koehler is the North American Electronic Systems Business Development Manager for Henkel Corporation's Automotive Component Engineering Solutions group. He brings business development experience from managing Henkel's adhesive portfolio for our electronics business for +15 years with 30 years of overall adhesive and sealant technologies in the automotive industry. Jeff's goal is to find innovative sealing and bonding solutions for components such as ECU's, connectors, wire harnesses, etc. He is leading Henkel's electronics team in developing innovative products to reduce our customers product costs, manufacturing assembly time and in plant footprint.

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